PlasmaPREPLATE

PlasmaPREPLATE process was designed for surface cleaning, surface oxide removal and annealing prior to plating for wires, strip or tube. PlasmaPREPLATE is a chemical-free alternative to chemical cleaning and fluxing. PlasmaPREPLATE can be installed in-line with electroplating or hot dip plating.

The effects of PlasmaPREPLATE process on the material:

  • Heat treatment: homogenous mechanical properties
  • Surface cleaning: removal of fine surface deposits
  • Degreasing: removal of wet lubricant for dry surface finish
  • Surface oxide removal: deoxidation under ion bombardment
  • Surface activation: surface preparation for better coating adhesion

Vertical PlasmaPREPLATE for hot-dip plating:

  • High plating speed
  • Acid-free surface preparation
  • Flux-free hot dip plating
  • Strong intermetallic layer
  • Low cost of operation
  • Integrated surface quality control

Horizontal PlasmaPREPLATE for electroplating:

  • High-speed surface preparation
  • Simultaneous heat treatment
  • No acid pre-cleaning, no rinsing
  • Improved plating performance
  • Reduced cost of electroplating

Process type: Continuous
Material form: wire, rod, tube, strip, flat wire

Materials:

  • Copper and copper alloys
  • Steel alloys
  • Nickel, nickel alloys and nitinol
  • Aluminium and aluminium alloys

Download PlasmaPREPLATE Product Sheet: